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There is a strong interest to implement antennain-package (AiP) systems for a cohort of applications such as imaging, beamforming, integrated transceivers, and radars. Substrate integrated pyramidal antennas (SIPA) are valuable AiP candidates owing to their small form factor, integration ease, and high gain. However, height reduction and substrate integration can drastically reduce the overall directivity of such antennas and hence limit their potential applications. This degradation is mainly due to surface waves propagating and radiating on the dielectric. For the first time in this paper, we present a 94GHz low temperature cofired ceramic (LTCC) integrated pyramidal horn antenna. To prevent transverse magnetic (TM) surface waves, a mushroom type electromagnetic bandgap (EBG) structure is implemented in the surrounding of the horn. The LTCC fabrication is particularly suitable for this kind of structure. Since only a single well is needed to fabricate the horn and the EBG structure, complexity and cost are minimized. The combined antenna with EBG surrounding leads to approximately 1.8dB improvement in maximum directivity. Concurrently, the 3dB beamwidth is reduced by 10 for the E-Plane and 20 for the H-Plane